| 摘要 |
Disclosed is a laser grooving method for forming a groove by applying laser and nanosecond laser to a wafer simultaneously or sequentially. The laser grooving method comprises the steps of: providing a wafer including a groove manufacturing area for forming a groove; forming a first groove by radiating a first laser beam to each of the side edges of the groove manufacturing area; and forming a second groove by radiating a second laser beam to the groove manufacturing area between the first grooves, wherein the second laser beam has a smaller pulse width than the first laser beam. |
