| 摘要 |
An embodiment of the present invention relates to a thermal compression bonding device which is characterized by comprising an upper mold part (150) lifted by being supplied with a heat by a temperature controlling part (195); a lower mold part (180) formed to face the upper mold part (150), and supplied with a heat from the temperature controlling part (195); and a pad (180) uniformly supplying heat of the upper mold part (150) to a cover (200) put into the lower mold part (170). |
