发明名称 |
APPARATUS AND METHOD FOR BONDING |
摘要 |
The present invention relates to a bonding apparatus and a method thereof. A bonding apparatus according to one embodiment of the present invention includes a support unit which is mounted on at least one surface of a substrate; a bonding tool which bonds a device to the substrate; and a cleaning assembly which is installed at the support unit and cleans one surface of the support unit. |
申请公布号 |
KR20140095301(A) |
申请公布日期 |
2014.08.01 |
申请号 |
KR20130008127 |
申请日期 |
2013.01.24 |
申请人 |
SAMSUNG DISPLAY CO., LTD. |
发明人 |
EOM, DONG BIN |
分类号 |
H01L21/58 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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