METHOD AND APPARATUS FOR FABRICATING UNIFORM FINE SOLDER BALL USING ELECTRIC FIELD
摘要
The purpose of the present invention is to provide an apparatus and a method of continuously fabricating a solder ball at low costs which simplify a fabrication process and improves yield by a method which controls the size of a liquid drop generated by using the magnitude of voltage and frequency, and generates uniform liquid drops which are smaller than a nozzle pipe by applying AC voltage to a Taylor-cone-type liquid generated by an electric field without applying mechanical vibration to a melting chamber.
申请公布号
KR20140095186(A)
申请公布日期
2014.08.01
申请号
KR20130007777
申请日期
2013.01.24
申请人
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
发明人
SUNG, HYUNG JIN;KIM, SANG SOO;OH, YONG SUK;CHOI, DONG YUN;KANG, HYUN WOOK;JUNG, JIN HO