发明名称 METHOD AND APPARATUS FOR FABRICATING UNIFORM FINE SOLDER BALL USING ELECTRIC FIELD
摘要 The purpose of the present invention is to provide an apparatus and a method of continuously fabricating a solder ball at low costs which simplify a fabrication process and improves yield by a method which controls the size of a liquid drop generated by using the magnitude of voltage and frequency, and generates uniform liquid drops which are smaller than a nozzle pipe by applying AC voltage to a Taylor-cone-type liquid generated by an electric field without applying mechanical vibration to a melting chamber.
申请公布号 KR20140095186(A) 申请公布日期 2014.08.01
申请号 KR20130007777 申请日期 2013.01.24
申请人 KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 SUNG, HYUNG JIN;KIM, SANG SOO;OH, YONG SUK;CHOI, DONG YUN;KANG, HYUN WOOK;JUNG, JIN HO
分类号 H01L21/60;H01L23/488 主分类号 H01L21/60
代理机构 代理人
主权项
地址