| 摘要 |
<p>PURPOSE: A method for manufacturing a print wiring board is provided to easily expose a wiring pattern without the damage of the wiring pattern and the warpage of the print wiring board. CONSTITUTION: A wiring pattern(3) including a bonding pad(3a) and a solder ball pad(3b) is formed on the surface of an insulating board(1). A blast buffer layer(4) is formed to cover the wiring pattern. A prepreg(5) in which a thermosetting resin is immersed in glass fabric(2) is stacked on the blast buffer layer. The blast resist(6) with a resist aperture(6a) is formed on the wiring pattern. The prepreg exposed from the resist aperture is removed.</p> |
