| 摘要 |
A marking area correcting method of a wafer marking device, which is the present invention, includes an arrangement step, a first image obtaining step, a second image obtaining step, a first correcting step, a third image obtaining step, and a second correcting step. In the arrangement step, a correcting plate having multiple arrangement marks displayed on the same position of the top and bottom surfaces is placed on a support having the open central part. In the first image obtaining step, a first arrangement mark, which is placed on the central part among the arrangement marks displayed on the top surface of the correcting plate and the central part of an image area of a top image obtaining part, is harmonized and an image of the first arrangement mark image is obtained. In the second image obtaining step, a image of a second arrangement mark, which is placed on the central part, among arrangement marks displayed on the bottom surface of the correcting plate is obtained by using a bottom image obtaining part. In the first correcting step, a first deviation which is a deviation between the position of the second arrangement mark and the position of the first arrangement mark is calculated, and a deviation between the top image obtaining part and the bottom image obtaining part is corrected. In the third image obtaining step, a laser beam is emitted to one of the bottom arrangement marks, and an image displaying the laser beam and the arrangement mark at the same time is obtained by using the bottom image obtaining part. In the second correcting step, a second deviation, which is a deviation between the actual position to which the laser beam is emitted and the position of the arrangement mark, is calculated, and the corrected position of the laser beam is corrected to make the second deviation be within a preset reference deviation. |
