发明名称 DEVICE OF BREAKING BRITTLE MATERIAL SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a device of breaking a brittle material substrate capable of breaking the substrate vertically from a scribe line.SOLUTION: Receiving blades 54A and 54B are rotatably fixed above a pair of support members 53A and 53B mounted to be movable with a minute interval. The receiving blades are closed, and a substrate 40 is arranged so that a position of the substrate 40 is adjusted to a scribe line 43. The substrate 40 is pressed by a blade 23 from above. Thus, the receiving blades move rotationally mutually in opposite directions, and the substrate 40 can be broken in a cross section perpendicular to the scribe line.</p>
申请公布号 JP2014139025(A) 申请公布日期 2014.07.31
申请号 JP20140061766 申请日期 2014.03.25
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 SUGATA MITSURU;MURAKAMI KENJI;TAKEDA MASAKAZU
分类号 B28D5/00;B26F3/00;B28D1/22;H01L21/301 主分类号 B28D5/00
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