| 发明名称 |
METHOD OF APPLYING PHOTORESIST TO A SEMICONDUCTOR SUBSTRATE |
| 摘要 |
A method comprises dispensing a first solvent on a semiconductor substrate; dispensing a first layer of a high-viscosity polymer on the first solvent; dispensing a second solvent on the first layer of high-viscosity polymer; and spinning the semiconductor substrate after dispensing the second solvent, so as to spread the high-viscosity polymer to a periphery of the semiconductor substrate. |
| 申请公布号 |
US2014210057(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
US201313752954 |
申请日期 |
2013.01.29 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
Lin Yen-Chen;Chang Ching-Hsin;Chu Chia-Hung;Lin Hu-Wei;Hsu Chih-Hsien;Chou Hong-Hsing |
| 分类号 |
G03F7/00;H01L29/02 |
主分类号 |
G03F7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
dispensing a first solvent on a semiconductor substrate; dispensing a first layer of a high-viscosity polymer on the first solvent; dispensing a second solvent on a top surface of the first layer of the high-viscosity polymer; and spinning the semiconductor substrate after dispensing the second solvent, so as to spread the high-viscosity polymer to a periphery of the semiconductor substrate. |
| 地址 |
Hsin-Chu TW |
