| 摘要 |
<p>The invention relates to a process for manufacturing a printed circuit board comprising a first main circuit board (N) having a first structure, characterised in that it comprises a succession of steps appropriate for inserting one or more secondary printed circuit boards (RF) having a different structure to that of the main printed circuit board, said steps comprising: a step in which one or more cavities (40) appropriate for receiving the one or more inserts are defined; a step of preparing the one or more inserts (20) comprising on at least one face intended to make contact with a wall (40f) of the cavity etched patterns and a metallisation, and one or more vias (20i); a step of inserting the one or more inserts (20) into the one or more cavities (40) of said main circuit board; a step of introducing a resin into the one or more cavities (40) in order to hold the assembly formed by the main circuit board and the one or more secondary circuit boards together; and a step of laminating the assembly formed by the one or more inserts placed in the main circuit board.</p> |
