发明名称 DEVICE FOR METALISING SUBSTRATES
摘要 The invention relates to a device for metalising substrates. In particular, the invention relates to the field of contact elements used to electroplate solar cells within the context of a wet-chemical continuous treatment system. A wet-chemical treatment system according to the invention, for electrochemically coating flat substrates (1) with coating material, has a tank for accommodating an electrolyte, transporting means, by means of which the flat substrates (1) can be transported through the electrolyte horizontally, and at least one contact element (2), which comprises a shaft (4) having an axis of rotation (5) and a cylindrical circumferential surface suitable for rolling on the substrate (1), wherein the circumferential surface comprises at least one electrically insulating segment (3B) and at least one electrically conductive segment (3A), which can be connected to a current source (6) in such a way that the polarity can be reversed, wherein the axis of rotation (5) of the contact element (2) is positioned above the surface of the electrolyte, and wherein the contact element (2) is designed as a consumable electrode.
申请公布号 WO2014114789(A1) 申请公布日期 2014.07.31
申请号 WO2014EP51511 申请日期 2014.01.27
申请人 HOCHSCHULE OFFENBURG 发明人 KRAY, DANIEL
分类号 C25D17/00 主分类号 C25D17/00
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