HEAT RADIATION SHEET, HEAT RADIATION DEVICE, AND MANUFACTURING METHOD OF HEAT RADIATION DEVICE

摘要

PROBLEM TO BE SOLVED: To lower heat resistance between a heat sink 13 of a semiconductor switching element 10 and a tube 30a in an on-vehicle heat radiation device 1.SOLUTION: A heat radiation sheet 20a is disposed between a heat sink 13 of a semiconductor switching element 10 and a tube 30a. A porous base material 21a of the heat radiation sheet 20a is compressed by the heat sink 13 and the tube 30a. A heat conduction material, which is seeped from the porous base material 21a in conjunction with the compression of the porous base material 21a, is disposed between the porous base material 21a and the heat sink 13 of the semiconductor switching element 10 and between the porous base material 21a and the tube 30a. In other words, a gap between the heat radiation sheet 20a and the heat sink 13 and a gap between the heat radiation sheet 20a and the tube 30a are filled with the heat conduction material.