| 发明名称 |
Wafer Edge Trimming Tool Using Abrasive Tape |
| 摘要 |
A wafer edge trimming tool includes an abrasive tape and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process. |
| 申请公布号 |
US2014213152(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
US201313836439 |
申请日期 |
2013.03.15 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chang Tang-Kuei;Wei Kuo-Hsiu;Chen Kei-Wei;Yang Huai-Tei;Wang Ying-Lang |
| 分类号 |
B24B9/06;B24B21/00;B24B21/08 |
主分类号 |
B24B9/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer edge trimming tool, comprising:
an abrasive tape; and a holding module configured to hold the abrasive tape against portions of an edge of a rotating wafer during a wafer edge trimming process. |
| 地址 |
US |
