Method for joining thermally sensitive structures between electronic components, involves applying thermal load within outline portions of to be joined contacts formed on solder interconnection layers of solder layer system

摘要

The method involves forming largely solid solder bonding layer is formed on mutually associated surface portions of to be joined together components. The largely solid solder bonding layer is respectively localized on a surface portion of molten material. The reactants of the nano-reactive film system are mixed with residues, after cooling and solidification of the entire molten material. The thermal load is applied within the outline portions of to be joined contacts formed on solder interconnection layers of the solder layer system. An independent claim is included for solder layer system.