METHOD OF FORMING INTERCONNECTION LINES

摘要

The invention concerns a method comprising: forming a plurality of parallel lines (502, 504, 506) of a sacrificial material over a layer of conductive material (510) of an integrated circuit, said parallel lines being separated by trenches, at least one of said lines being interrupted along its length by an opening (516) dividing it into first and second line portions (504A, 504B) separated by a space (S); forming spacers (522, 524, 526, 528, 530) in said trenches on lateral sides of said line portions and filling at least a bottom part of said opening between the line portions; removing the sacrificial material by etching; and forming interconnection lines (302, 304A, 304B, 306A, 306B, 308, 310) of said conductive material based on a pattern defined by said spacers.

主权项

1. A method comprising:
forming a plurality of parallel lines of a sacrificial material over a layer of conductive material of an integrated circuit, said parallel lines being separated by trenches, at least one of said lines being interrupted along its length by an opening dividing it into first and second line portions separated by a space; forming spacers in said trenches on lateral sides of said line portions and filling at least a bottom part of said opening between the line portions; removing the sacrificial material by etching; and forming interconnection lines of said conductive material based on a pattern defined by said spacers.