发明名称 |
BASE MATERIAL PARTICLE, CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE |
摘要 |
<p>Provided is a base material particle that, when electrically connecting between electrodes using conductive particles having a conductive layer formed at the surface thereof, can reduce connection resistance and can suppress the occurrence of cracks at the electrodes. The base material particle (11) has a conductive layer (2) formed at the surface thereof and is used for obtaining conductive particles (1) having a conductive layer (2). The base material particle (11) is a core-shell particle provided with a core (12) and a shell (13) disposed at the surface of the core (12). The compression recovery rate of the base material particle (11) is at least 50%. The compression modulus of elasticity of the base material particle (11) when compressed by 10% is at least 3000 N/mm2 and less than 6000 N/mm2. The ratio of the load value of the base material particle (11) when compressed by 30% with respect to the load value when compressed by 10% is no greater than 3.</p> |
申请公布号 |
WO2014115467(A1) |
申请公布日期 |
2014.07.31 |
申请号 |
WO2013JP84487 |
申请日期 |
2013.12.24 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
NAGAI, YASUHIKO;UENOYAMA, SHINYA;WANG, XIAOGE;YAMADA, YASUYUKI |
分类号 |
C08J3/12;H01B1/00;H01B1/22;H01B5/00;H01B5/16;H01R11/01 |
主分类号 |
C08J3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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