发明名称 MOLDING DIE SET AND RESIN MOLDING APPARATUS HAVING THE SAME
摘要 The present molding die set includes: a first molding die with a first molding chase, a cavity piece supported by the first molding chase and configures the lower part of a cavity, and a movable clamper which is movably supported by the first molding chase and encloses the cavity piece to form a cavity-recess unit; a second molding die with a second molding chase, a work supporting unit which is biased and supported by the second molding chase and on where a work will be mounted, and a center insert located adjacent to the work supporting unit; and a pot which is provided for one among the first molding die and the second molding die to supply a resin to mold the work. The second molding die additionally includes a thickness adjusting device to make the work supporting unit absorb the thickness variation of the work and bring the work in contact with the movable clamper when the work supported by the work supporting unit is clamped with the movable clamper of the first molding die.
申请公布号 KR20140095043(A) 申请公布日期 2014.07.31
申请号 KR20140086114 申请日期 2014.07.09
申请人 APIC YAMADA CORPORATION 发明人 MAEKAWA MASANORI;TAKAHASHI TOMOKAZU
分类号 B29C45/02;B29C45/14;B29C45/26;B29C45/57 主分类号 B29C45/02
代理机构 代理人
主权项
地址