发明名称 HEAT-CONDUCTIVE RESIN COMPOSITION
摘要 The present invention is capable of providing a heat-conductive resin composition containing 70 to 20 parts by volume of (A) a polyester resin having a melt viscosity at 200°C and 10 kgf loading of 5 to 10,000 dPa·s, and 30 to 80 parts by volume of (B) a heat-conductive filler, wherein the heat-conductive resin is characterized in that the heat-conductive filler (B) contains zinc oxide and magnesium oxide and is a mixture of two or more types having different average particle sizes, the zinc oxide having a smaller average particle size than that of the magnesium oxide. The highly heat-conductive resin composition exhibits excellent performance as a filler and excellent heat and humidity resistance.
申请公布号 WO2014115649(A1) 申请公布日期 2014.07.31
申请号 WO2014JP50776 申请日期 2014.01.17
申请人 TOYOBO CO., LTD. 发明人 SHIMOHARAI, TAKUYA;MITSUNAGA, HIROYUKI;KOBAYASHI, KOJI
分类号 C08L67/00;C08K3/22 主分类号 C08L67/00
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