Die package with Openings Surrounding End-portions of Through Package Vias (TPVs) and Package on Package (PoP) Using the Die Package

摘要

Various embodiments of mechanisms for forming through package vias (TPVs) with openings surrounding end-portions of the TPVs and a package on package (PoP) device with bonding structures utilizing the TPVs are provided. The openings are formed by removing materials, such as by laser drill, surrounding the end-portions of the TPVs. The openings surrounding the end-portions of the TPVs of the die package enable solders of the bonding structures formed between another die package to remain in the openings without sliding and consequently increases yield and reliability of the bonding structures. Polymers may also be added to fill the openings surrounding the TPVs or even the space between the die packages to reduce cracking of the bonding structures under stress.

主权项

1. A semiconductor device comprising:
a semiconductor die; a dielectric material adjacent the semiconductor die; and a through package via (TPV) disposed in the dielectric material, wherein an opening in the dielectric material surrounds an end portion of the TPV to expose the end portion, and wherein at least a portion of the opening is between the end portion of the TPV and molding compound.