| 发明名称 |
INTEGRATED STRUCTURE WITH IMPROVED HEAT DISSIPATION |
| 摘要 |
An integrated structure includes a support supporting at least one chip and a heat dissipating housing, attached to the chip. The housing is thermally conductive and has a thermal expansion compatible with the chip. The housing may further including closed cavities filled with a phase change material. |
| 申请公布号 |
US2014210071(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
US201414155007 |
申请日期 |
2014.01.14 |
| 申请人 |
Lombardot Anne;STMicroelectronics (Crolles 2) SAS ;STMicroelectronics SA |
发明人 |
Chapelon Laurent-Luc;Ancey Pascal;Lhostis Sandrine |
| 分类号 |
H01L23/36 |
主分类号 |
H01L23/36 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An integrated structure, comprising:
a substrate supporting at least one chip; and a heat dissipating housing, attached to the chip, being thermally conductive and having a thermal expansion compatible with the chip. |
| 地址 |
US |
