| 发明名称 |
HORIZONTALLY ALIGNED GRAPHITE NANOFIBERS IN ETCHED SILICON WAFER TROUGHS FOR ENHANCED THERMAL PERFORMANCE |
| 摘要 |
The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip, and a heat removal device thermally connected to the thermal interface material pad. |
| 申请公布号 |
US2014210068(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
US201313754149 |
申请日期 |
2013.01.30 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
Bartley Gerald K.;Johnson Charles L.;Kelly, III John E.;Kuczynski Joseph;Motschman David R.;Sinha Arvind K.;Splittstoesser Kevin A.;Tofil Timothy A. |
| 分类号 |
H01L21/50;H01L23/00 |
主分类号 |
H01L21/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for enhancing the cooling of a chip stack of semiconductor chips, comprising:
creating a first chip with circuitry on a first side; creating a second chip with circuitry on a first side that is electrically and mechanically coupled to the first chip by a grid of connectors; placing a thermal interface material pad between the first chip and the second chip, wherein the thermal interface material pad includes nanofibers aligned parallel to mating surfaces of the first chip and the second chip; and creating a heat removal device thermally connected to the thermal interface material pad. |
| 地址 |
Armonk NY US |
