SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes: a semiconductor substrate formed with an element region; a first conductive type first region formed in the element region and located on a surface side of the semiconductor substrate; a second conductive type second region located in a deeper position than the first region in the element region and contacting the first region; a first conductive type third region located in a deeper position than the second region in the element region, contacting the second region, and separated from the first region by the second region; and a gate disposed in a trench extending from the surface to reach the third region, and contacting a range of the second region via the insulation film. A thickness of the second region in a depth direction is gradually increased from the peripheral part of the element region to the central part thereof

主权项

1. A semiconductor device comprising:
a semiconductor substrate formed with an element region; a first conductive type first region that is formed in the element region and located on a surface side of the semiconductor substrate; a second conductive type second region that is located in a deeper position than the first region in the element region and contacts the first region; a first conductive type third region that is located in a deeper position than the second region in the element region, contacts the second region, and is separated from the first region by the second region; and a gate that is disposed in a trench extending from the surface of the semiconductor substrate to reach the third region and contacts a range of the second region that separates the first region from the third region via an the insulation film, wherein a thickness of the second region in a depth direction is gradually increased from a peripheral part of the element region to a central part of the element region.