| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting element and a light-emitting element package, which can achieve high luminance and improved adhesion.SOLUTION: A light-emitting element 1 comprises: a sapphire substrate 2 having a surface 3 on a light extraction surface side and a rear face 4 on the opposite side to the surface 3; a first conductivity type semiconductor layer 6 stacked on the surface 3 of the sapphire substrate 2; a luminescent layer 7 stacked on the first conductivity type semiconductor layer 6; a second conductivity type semiconductor layer 8 stacked on the luminescent layer 7; a reflection layer 11; and an adhesion layer 10. The reflection layer 11 contains Ag and is arranged on the rear face 4 side of the sapphire substrate 2, for reflecting light from the sapphire substrate 2 toward the surface 3 of the sapphire substrate 2. The adhesion layer 10 is composed of ITO and is arranged between the sapphire substrate 2 and the reflection layer 11 and adheres to the reflection layer 11. |
