| 摘要 |
PROBLEM TO BE SOLVED: To efficiently radiate heat of a wavelength conversion plate including a fluorescent material from a sub heat radiation passage different from a heat radiation passage passing through an LED chip as well as the heat radiation passage, prevents the deterioration of the luminous efficiency of the fluorescent material caused by heat, realizes light emission with high luminance, and prevents the heat deterioration of the wavelength conversion plate and peripheral members of the wavelength conversion plate thereby achieving long life of the light emitting device.SOLUTION: In a light emitting device 1, an LED chip 10 is mounted on a substrate part 3 of a mount case 2 in a flip chip manner, and a wavelength conversion plate 7 including a fluorescent material 8 is disposed at the light extraction surface side of the LED chip 10. Further, a sub heat radiation passage 20 which radiates heat of the wavelength conversion plate 7 is formed by a transparent heat conduction film 21 provided on a surface of the wavelength conversion plate 7 and a ribbon wire 22 serving as a heat connection member which thermally connects the transparent heat conduction film 21 with the substrate part 3. |
