发明名称 HEAT INSULATION FILM FORMATION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat insulation film formation method capable of enhancing adhesion force between a heat insulation film which has low heat conductivity and low heat capacity and a base material of a cylinder block and the like.SOLUTION: An admixture 4 formed by mixing a hollow particle 2 and a binder 3 is coated on a die surface of a molding tool K. A solvent included in the binder 3 of the admixture 4 is removed for forming a heat insulation film intermediate body 9 having a crack G going from a surface 4a toward a surface 4b of the admixture 4 on a mold surface of a molding tool K. A molten metal 6 is impregnated into the molding tool K for impregnating the molten metal 6 in the crack G of the heat insulation film intermediate body 9. And curing the molten metal 6 is performed for form removal of the integrated molten metal 6 and the heat insulation film intermediate body 9, and a heat insulation film 5 formed by impregnating a part of a base material 7 in the crack G and curing, is formed on a surface of the base material 7.</p>
申请公布号 JP2014138951(A) 申请公布日期 2014.07.31
申请号 JP20130008671 申请日期 2013.01.21
申请人 TOYOTA MOTOR CORP 发明人 EDA AKINORI ; SUGIYAMA NATSUKI
分类号 B22D19/08;B22C3/00;B22D27/18;C04B37/02;C23C26/00 主分类号 B22D19/08
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