发明名称 INTEGRATED CIRCUIT SYSTEM WITH DISTRIBUTED POWER SUPPLY
摘要 An integrated circuit system comprises an interposer, a first integrated circuit, and at least one voltage regulator module. The first integrated circuit comprises first bond pads, and is electrically connected to the interposer at a first position of the interposer via the first bond pads. The first integrated circuit also comprises second bond pads. The first integrated circuit further comprises at least two circuit blocks. The at least two circuit blocks are configured to operate at different operating voltages. The at least one voltage regulator module is electrically connected to the first integrated circuit via the second bond pads, and the at least one voltage regulator module is configured to convert a received power supply voltage to the respective operating voltage of one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads.
申请公布号 US2014210077(A1) 申请公布日期 2014.07.31
申请号 US201414228986 申请日期 2014.03.28
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 CHI Shyh-An;PENG Mark Shane;LEE Yun-Han
分类号 H01L23/498;H01L23/48 主分类号 H01L23/498
代理机构 代理人
主权项 1. An integrated circuit system comprising: an interposer; a first integrated circuit comprising: first bond pads on a front surface of the first integrated circuit, the first integrated circuit being electrically connected to the interposer at a first position of the interposer via the first bond pads;second bond pads on a back surface of the first integrated circuit, the back surface being opposite the front surface; andat least two circuit blocks, the at least two circuit blocks being configured to operate at different operating voltages; and at least one voltage regulator module electrically connected to the back surface of the first integrated circuit via the second bond pads, the at least one voltage regulator module being configured to convert a received power supply voltage to the respective operating voltage of a respective one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads.
地址 Hsinchu TW