发明名称 RADIUSED ALIGNMENT POST FOR SUBSTRATE MATERIAL
摘要 A method includes growing a substrate material that includes an integrated circuit. The method includes forming an alignment post on the substrate material and forming a radiused top portion on the alignment post to enable alignment of a connector to the substrate material.
申请公布号 WO2014116253(A1) 申请公布日期 2014.07.31
申请号 WO2013US23422 申请日期 2013.01.28
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 ROSENBERG, PAUL KESSLER;TAN, MICHAEL RENNE TY;MATHAI, SAGI
分类号 H01L21/02;H01L21/027 主分类号 H01L21/02
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