A method includes growing a substrate material that includes an integrated circuit. The method includes forming an alignment post on the substrate material and forming a radiused top portion on the alignment post to enable alignment of a connector to the substrate material.
申请公布号
WO2014116253(A1)
申请公布日期
2014.07.31
申请号
WO2013US23422
申请日期
2013.01.28
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
ROSENBERG, PAUL KESSLER;TAN, MICHAEL RENNE TY;MATHAI, SAGI