发明名称 STACK INCLUDING INSPECTION CIRCUIT, INSPECTION METHOD AND INSPECTION APPARATUS
摘要 According to one embodiment, a stack includes first and second wiring structures and an inspection circuit. The inspection circuit includes a switching circuit having an input terminal, a drive terminal, and an output terminal electrically connected with a discharge mechanism. The inspection circuit is configured such that, in a state where a first electric connection is made in the first wiring structure and a second electric connection is made in the second wiring structure, at the time of applying charges to first and second electrodes, the charge applied to the second electrode flows to the drive terminal through the second wiring structure to bring the input terminal and the output terminal of the switching circuit into an electrically conducted state, and the charge applied to the first electrode flows to the discharge mechanism through the first wiring structure and the switching circuit.
申请公布号 US2014210497(A1) 申请公布日期 2014.07.31
申请号 US201313945298 申请日期 2013.07.18
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ENDO Mitsuyoshi
分类号 G01R31/265 主分类号 G01R31/265
代理机构 代理人
主权项 1. A stack comprising: a semiconductor substrate; a first wiring structure for electrically connecting a first electrode exposed on the front surface of the stack and a first terminal located in the stack; a second wiring structure for electrically connecting a second electrode exposed on the front surface of the stack and a second terminal located in the stack; and an inspection circuit that inspects states of electric connections in the first and second wiring structures, wherein the inspection circuit includes a switching circuit having an input terminal electrically connected with the first terminal, a drive terminal electrically connected with the second terminal, and an output terminal electrically connected with a discharge mechanism, and is configured such that, in a state where a first electric connection is made in the first wiring structure and a second electric connection is made in the second wiring structure, at the time of applying charges to the first and second electrodes, the charge applied to the second electrode flows to the drive terminal through the second wiring structure to bring the input terminal and the output terminal of the switching circuit into an electrically conducted state, and the charge applied to the first electrode flows to the discharge mechanism through the first wiring structure and the switching circuit.
地址 Tokyo JP