| 发明名称 |
APPARATUS, METHOD, AND COMPOSITION FOR FAR EDGE WAFER CLEANING |
| 摘要 |
A wafer cleaning apparatus includes a polishing unit used in chemical mechanical polishing (CMP) of a wafer and a cleaning dispensing unit arranged to direct cleaning fluids toward a far edge of the wafer after the CMP of the wafer. A wafer cleaning method includes CMP of a wafer by a polishing unit and directing cleaning fluids toward a far edge of the wafer after the CMP of the wafer by a cleaning dispensing unit. Another method can include CMP, applying deionized water, and applying pH adjuster having a pH range from about 2 to about 13. |
| 申请公布号 |
US2014213056(A1) |
申请公布日期 |
2014.07.31 |
| 申请号 |
US201313752415 |
申请日期 |
2013.01.29 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LU Hsin-Hsien;CHANG Ting-Kui;TSAI Jung-Tsan |
| 分类号 |
H01L21/306 |
主分类号 |
H01L21/306 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer cleaning apparatus, comprising:
a polishing unit used in chemical mechanical polishing (CMP) of a wafer; and a cleaning dispensing unit arranged to direct cleaning fluids toward a far edge of the wafer after the CMP of the wafer. |
| 地址 |
Hsin-Chu TW |
