| 摘要 |
<p>In patent document (1), height measurement performed with an atomic force microscope (AFM) is used as a means for measuring microroughness. However, it is difficult to use an AFM in inline all-piece inspection or all-surface inspection of wafers as one expression due to the time required for the measuring. The present invention estimates microroughness from signal summations and signal ratios from a plurality of detection systems by using light scattering. The present invention measures all surfaces of wafers with a high through-put by rotating and translating the wafers at high speeds. The relationship between microroughness and the amount of light scattering differs according to the material and film thickness of the wafers. Calibration of the device is necessary. The present invention addresses this issue and has a function for correcting a detection result optically obtained by using a sample that is substantially the same as an article to be measured, and the optically obtained detection results more closely approach the results measured with a device (such as an AFM) that uses another measurement principle.</p> |
