发明名称 CURABLE RESIN COMPOSITIONS
摘要 A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged.
申请公布号 US2014212582(A1) 申请公布日期 2014.07.31
申请号 US201214236934 申请日期 2012.07.18
申请人 Padilla-Acevedo Angela I.;Valette Ludovic;Mullins Michael J.;Verghese Kandathil E.;Wilson Mark B. 发明人 Padilla-Acevedo Angela I.;Valette Ludovic;Mullins Michael J.;Verghese Kandathil E.;Wilson Mark B.
分类号 C08G59/24;C09D163/00 主分类号 C08G59/24
代理机构 代理人
主权项 1. A solventless curable epoxy resin composition comprising (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solventless curable epoxy resin composition is solvent-free; wherein the solventless curable epoxy resin composition has at least two exotherm peaks; and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the solventless curable epoxy resin composition of being B-staged.
地址 Lake Jackson TX US