| 摘要 |
A semiconductor device (100) with a leadframe having first (310) and second (311) leads with central and peripheral ends, the central ends in a first horizontal plane (150). The first leads have peripheral ends (310b) in a second horizontal plane spaced (160) from the first plane and the second leads having peripheral ends in a third horizontal plane (170). A semiconductor chip (101) is connected to the central lead ends. A package (120) encapsulates the chip and the central ends of the first and second leads, leaving the peripheral ends of the first and second leads un-encapsulated, wherein the packaged device has lead ends as terminals on the second and third horizontal plane. |
