THERMOSETTING RESIN COMPOSITION FOR SEALING SHEET-FORM ELECTRONIC COMPONENT, RESIN-SEALED SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

Provided are: a thermosetting resin composition for sealing a sheet-form electronic component, the thermosetting resin composition complying with flame retardancy standard UL94 V-0 and having excellent post-curing strength; a high-reliability resin sealed semiconductor device; and a method of manufacturing a resin-sealed semiconductor device. The present invention relates to a thermosetting resin composition for sealing a sheet-form electronic component, the thermosetting resin composition having a specific silica content, compliance with flame retardancy standard UL94 V-0, and a three-point bending strength at ambient temperature following heating for 1 hour at 150°C and curing of 80 MPa or higher.