发明名称 RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, RESIN-MOLDED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED ARTICLE WITH PLATED LAYER
摘要 <p>Provided is a resin composition excellent in mechanical strength while maintaining LDS activity. The resin composition for laser direct structuring comprises, relative to 100 parts by weight of a polycarbonate resin component, 10 to 100 parts by weight of a glass filler and 1 to 30 parts by weight of a laser direct structuring additive, wherein the polycarbonate resin component consists of 80 to 30% by weight of a polycarbonate resin and 20 to 70% by weight of a styrene-based resin, or consists of a polycarbonate; and the laser direct structuring additive comprises antimony and tin.</p>
申请公布号 KR20140095110(A) 申请公布日期 2014.07.31
申请号 KR20147018103 申请日期 2013.06.05
申请人 MITSUBISHI ENGINEERING-PLASTICS CORPORATION 发明人 MOTEGI ATSUSHI;MARUYAMA HIROYOSHI
分类号 C08L69/00;C08K3/40;C08K5/59;C08L25/06;H01Q1/00 主分类号 C08L69/00
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