发明名称 MANAGING THERMAL BUDGET IN ANNEALING OF SUBSTRATES
摘要 A method and apparatus are provided for treating a substrate. The substrate is positioned on a support in a thermal treatment chamber. Electromagnetic radiation is directed toward the substrate to anneal a portion of the substrate. Other electromagnetic radiation is directed toward the substrate to preheat a portion of the substrate. The preheating reduces thermal stresses at the boundary between the preheat region and the anneal region. Any number of anneal and preheat regions are contemplated, with varying shapes and temperature profiles, as needed for specific embodiments. Any convenient source of electromagnetic radiation may be used, such as lasers, heat lamps, white light lamps, or flash lamps.
申请公布号 US2014209583(A1) 申请公布日期 2014.07.31
申请号 US201414229238 申请日期 2014.03.28
申请人 Applied Materials, Inc. 发明人 MOFFATT Stephen;MAYUR Abhilash J.;RAMAMURTHY Sundar;RANISH Joseph;HUNTER Aaron
分类号 B23K26/06;B23K26/12 主分类号 B23K26/06
代理机构 代理人
主权项 1. An apparatus for thermally treating a substrate, comprising: a movable substrate support; a first energy source for directing shaped annealing energy in a first shape toward a first portion of a surface of the substrate support; a second energy source for directing shaped preheat energy in a second shape different from the first shape toward a second portion of the surface of the substrate support; and an optical assembly housing the first and second energy sources.
地址 Santa Clara CA US