| 摘要 |
<p>This module includes a wiring substrate, and comprises land electrodes and wiring conductors which are arranged on the surface of said wiring substrate and which can be bonded to surface-mounted components with no solder interposed therebetween, allowing the module to be more compact and have a lower profile. This module (10) includes a wiring substrate (12). Land electrode units (16) and wiring conductor units (18) are arranged on one main surface (12a) of the wiring substrate (12). Surface-mounted components (20a, 20b) are bonded to the land electrode units (16) with external electrode units (34, 36) or external terminal units (38, 40) interposed therebetween. The surface-mounted components (20a, 20b) are mounted by the external electrode units (34, 36) or external terminal units (38, 40) of said surface-mounted components (20a, 20b) being bonded to the land electrodes (16) with Sn interposed therebetween.</p> |
