| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier, suitable for fine pitch formation.SOLUTION: The copper foil with a carrier includes a copper foil carrier, a release layer laminated on the copper foil carrier, and an ultrathin copper layer laminated on the release layer. The ultrathin copper layer is subjected to roughening treatment, and Rz of the surface of the ultrathin copper layer is 1.3 μm or less as measured with a non-contact roughness meter. |
