发明名称 |
LASER ANNEALING METHOD AND DEVICE |
摘要 |
A laser annealing method for executing laser annealing by irradiating a semiconductor film formed on a surface of a substrate with a laser beam, the method including the steps of, generating a linearly polarized rectangular laser beam whose cross section perpendicular to an advancing direction is a rectangle with an electric field directed toward a long-side direction of the rectangle or an elliptically polarized rectangular laser beam having a major axis directed toward a long-side direction, causing the rectangular laser beam to be introduced to the surface of the substrate, and setting a wavelength of the rectangular laser beam to a length which is about a desired size of a crystal grain in a standing wave direction. |
申请公布号 |
US2014213071(A1) |
申请公布日期 |
2014.07.31 |
申请号 |
US201314138273 |
申请日期 |
2013.12.23 |
申请人 |
Semiconductor Energy Laboratory Co., Ltd. |
发明人 |
KAWAKAMI Ryusuke;NISHIDA Kenichirou;KAWAGUCHI Norihito;MASAKI Miyuki;YOSHINOUCHI Atsushi |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
1. A laser annealing method for executing laser annealing by irradiating a semiconductor film formed on a surface of a substrate with a laser beam, the method including the steps of:
generating a linearly polarized rectangular laser beam whose cross section perpendicular to an advancing direction is a rectangle with an electric field directed toward a long-side direction of the rectangle or an elliptically polarized rectangular laser beam having a major axis directed toward a long-side direction; and causing the rectangular laser beam to be introduced to the surface of the substrate, wherein an energy density of the rectangular laser beam is greater than 500 mJ/cm2. |
地址 |
Atsugi-shi JP |