发明名称 LASER ANNEALING METHOD AND DEVICE
摘要 A laser annealing method for executing laser annealing by irradiating a semiconductor film formed on a surface of a substrate with a laser beam, the method including the steps of, generating a linearly polarized rectangular laser beam whose cross section perpendicular to an advancing direction is a rectangle with an electric field directed toward a long-side direction of the rectangle or an elliptically polarized rectangular laser beam having a major axis directed toward a long-side direction, causing the rectangular laser beam to be introduced to the surface of the substrate, and setting a wavelength of the rectangular laser beam to a length which is about a desired size of a crystal grain in a standing wave direction.
申请公布号 US2014213071(A1) 申请公布日期 2014.07.31
申请号 US201314138273 申请日期 2013.12.23
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 KAWAKAMI Ryusuke;NISHIDA Kenichirou;KAWAGUCHI Norihito;MASAKI Miyuki;YOSHINOUCHI Atsushi
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
主权项 1. A laser annealing method for executing laser annealing by irradiating a semiconductor film formed on a surface of a substrate with a laser beam, the method including the steps of: generating a linearly polarized rectangular laser beam whose cross section perpendicular to an advancing direction is a rectangle with an electric field directed toward a long-side direction of the rectangle or an elliptically polarized rectangular laser beam having a major axis directed toward a long-side direction; and causing the rectangular laser beam to be introduced to the surface of the substrate, wherein an energy density of the rectangular laser beam is greater than 500 mJ/cm2.
地址 Atsugi-shi JP