POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE WITH HEAT SINK

摘要

This power module substrate is provided with a circuit layer (12) formed on a first surface of a ceramic substrate (11), and a metal layer (13) formed on a second surface. The metal layer (13) has a first aluminum layer (13A) bonded to the second surface of the ceramic substrate (11), and a first copper layer (13B) joined to the first aluminum layer (13A) by solid-state diffusion bonding.