| 摘要 |
The present invention relates to a method for forming nickel nanocones to have a selected pattern, including the steps of: forming a seed layer, with the surface being exposed to have a specific shape, on a substrate; and forming nickel nanocones on the surface, which is exposed to have the specific shape, of the seed layer by performing an electroplating process in which a nickel electrode serves as an anode in an electrolyte, wherein the seed layer is made of a metal material of a face centered cubic (FCC) structure. Since the nickel nanocones are directly formed to have the specific pattern only by a quick and simple photolithographic process and the electroplating process, the costs required to form the nickel nano-structure is remarkably reduced. Also, since the nickel nanocones are formed in the pattern of the specific shape, the nanocone forming process of the present invention can be applied to a part of the conventional semiconductor process. The connection in the whole semiconductor process is increased, and the efficiency of the fabricated device is improved. In addition, since the process costs are not expensive, the nickel nanocone structure can be applied to a new field which is not used at present. |
