发明名称 |
BUILT-IN ELECTRONIC COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SUBSTRATE |
摘要 |
A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first substrate and covering the side surfaces of the electronic component, a second substrate provided above the electronic component and the first resin and layered on the first substrate, a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates, a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate, and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin. |
申请公布号 |
US2014210109(A1) |
申请公布日期 |
2014.07.31 |
申请号 |
US201414150952 |
申请日期 |
2014.01.09 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
TANAKA Koichi;KURASHIMA Nobuyuki;IIZUKA Hajime;SHIRAKI Satoshi |
分类号 |
H01L23/12;H01L21/56;H01L21/52 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
1. A built-in electronic component substrate comprising:
a first substrate; an electronic component including side surfaces and mounted on the first substrate; a first resin provided on the first substrate and covering the side surfaces of the electronic component; a second substrate provided above the electronic component and the first resin and layered on the first substrate; a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates; a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate; and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin. |
地址 |
Nagano JP |