ULTRA THIN PoP PACKAGE

摘要

A PoP (package-on-package) package includes a bottom package coupled to a top package. The bottom package includes a die coupled to an interposer layer with an adhesive layer. One or more terminals are coupled to the interposer layer on the periphery of the die. The terminals and the die are at least partially encapsulated in an encapsulant. The terminals and the die are coupled to a redistribution layer (RDL). Terminals on the bottom of the RDL are used to couple the PoP package to a motherboard or a printed circuit board (PCB). One or more additional terminals couple the interposer layer to the top package. The additional terminals may be located anywhere along the surface of the interposer layer.

主权项

1. A semiconductor device package, comprising:
a redistribution layer; an encapsulant above the redistribution layer; an interposer layer above the encapsulant; a die at least partially enclosed in the encapsulant, wherein the die is coupled to an upper surface of the redistribution layer and a lower surface of the interposer layer; and one or more terminals coupling at least part of the interposer layer to at least part of the redistribution layer, wherein the terminals are located in the encapsulant on a periphery of the die.