ALTERNATING CURRENT LIGHT EMITTING DIODE FLIP-CHIP

摘要

An alternating current light emitting diode flip chip is provided. The flip chip includes an alternating current light emitting diode chip having a first bond pad and a second bond pad formed thereon. A first solder ball is disposed on the first bond pad and a second solder ball is disposed on the second bond pad. A flip-chip bonding process is performed to bond a carrier substrate with the first solder ball and the second solder ball.

主权项

1. An alternating current light emitting diode flip-chip, comprising:
an alternating current light emitting diode chip; a first bond pad disposed on the alternating current light emitting diode chip; a second bond pad disposed on the alternating current light emitting diode chip; a carrier substrate; a first solder ball, disposed between the first bond pad and the carrier substrate; and a second solder ball, disposed between the second bond pad and the carrier substrate.