COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL, AND METHOD FOR PRODUCING COPPER-ALLOY PLATE FOR TERMINAL/CONNECTOR MATERIAL

摘要

This copper-alloy plate for a terminal/connector material: contains 4.5-12.0 mass% of Zn, 0.40-0.9 mass% of Sn, 0.01-0.08 mass% of P and 0.20-0.85 mass% of Ni, with inevitable impurities and Cu constituting the remainder thereof; satisfies the relationship 8≤Ni/P≤40 when satisfying the relationship 11≤Zn+7.5×Sn+16×P+3.5×Ni≤17 and containing 0.35-0.85 mass% of Ni; has an average crystal particle diameter of 2.0-8.0μm; has an average particle diameter of the circular or elliptical precipitate of 4.0-25.0nm, or contains a proportion of the number of precipitate particles having a particle diameter of 4.0-25.0nm among the precipitate particles of 70% or higher; has a conductivity of 30% IACS or higher; in terms of stress relaxation resistance properties, exhibits a percentage of stress relaxation after 1000 hours at 150°C of 30% or lower; has a bending workability when W-bending of R/t≤0.5; exhibits excellent solder wettability; and has a Young's modulus of 100×103N/mm2 or higher.