发明名称 DIE WITH MOBILE WALLS FOR SUCCESSIVE UPSETTING OPERATIONS
摘要 <p>The invention relates to a die meant to perform severe plastic deformations by multiple successive upsetting operations in order to obtain metal materials with ultrafine, for example, nanometric granulation. According to the invention, the die comprises a body (A) provided with an enclosure (a) confined by two walls (1 and 2) plated with some plates (3 and 4) by means of some screws (5) and an anvil-shaped plate (6) and a punch (7) which performs the first step of the upsetting operation vertically slides in the enclosure (a) guided by two cross-bars (8 and 9) embedded in some recesses (b) cut in the plates (3 and 4), the second step deformation being performed by the slide of two horizontal punches (10), under the cross-bars (8 and 9), being guided by the cross-bars and some plates (3, 4 and 6).</p>
申请公布号 RO129630(A2) 申请公布日期 2014.07.30
申请号 RO20070000448 申请日期 2007.06.22
申请人 UNIVERSITATEA TEHNIC&Abreve, ''GHEORGHE ASACHI'' DIN IA&Scedil,I 发明人 ZAHARIA LUCHIAN;CHIRI&Tcedil,&Abreve, CONSTANTIN;HANGANU ADRIAN CONSTANTIN
分类号 B21J5/10 主分类号 B21J5/10
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