发明名称 |
PRINTED CIRCUIT BOARD |
摘要 |
<p>A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component. The traces located closer to th edge of the flexible member are thicker to absorb stress.</p> |
申请公布号 |
EP2522206(B1) |
申请公布日期 |
2014.07.30 |
申请号 |
EP20100749586 |
申请日期 |
2010.08.31 |
申请人 |
APPLE INC. |
发明人 |
MCCLURE, STEPHEN R.;BANKO, JOSHUA D.;TERNUS, JOHN P. |
分类号 |
H05K1/14;G06F1/16;G06F1/18;H04M1/02;H05K1/02;H05K1/11 |
主分类号 |
H05K1/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|