发明名称 AN APPARATUS FOR SLICING AN INGOT
摘要 According to an embodiment of the present invention, an ingot cutting apparatus comprises rollers; wires wound on the rollers and reciprocating for cutting an ingot; an ingot fixing part located on the wires to fix the ingot having a front side, a rear side, and a lateral side located between the front side and the rear side; and a slurry nozzle located on the wires to correspond with the lateral side of the ingot, and having multiple slurry holes for providing slurry for the wires. The spacing distance between the lateral side of the ingot and one multiple slurry holes is different from the spacing distance between the lateral side of the ingot and the other multiple slurry holes.
申请公布号 KR20140094103(A) 申请公布日期 2014.07.30
申请号 KR20130006340 申请日期 2013.01.21
申请人 LG SILTRON INCORPORATED 发明人 KIM, NAM JAE
分类号 B28D5/04;B24B27/06;B28D7/00;H01L21/304 主分类号 B28D5/04
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