METHOD FOR REMOVING IMPURITY IN SILICON WAFER

摘要

A method of removing impurities from a silicon wafer according to an embodiment includes the steps of performing a grinding or polishing process by which a surface of the wafer is damaged; performing a low-temperature heating process to allow diffusion of a metal bulk in the wafer toward the surface of the wafer; and performing a process of wet etching the surface of the wafer after the low-temperature heating process.