METHOD AND APPARATUS FOR CONNECTING INLAID CHIP INTO PRINTED CIRCUIT BOARD

摘要

A method and apparatus for mounting microchips 3 into Printed Circuit Boards (PCB) 1 is described. The PCB 1 is provided with a cavity 2 into which the microchip 3 is mounted. Connections 28 are made to signal lines in the PCB 1 and the cavity 2 filled with molding compound 30. In some embodiments one 4 or two 5 inlaid metal layers are thermally connected to microchip 3 to improve thermal conductivity. Thermal panels 8 and 9 or heat sinks 18 and 19 are attached to the inlaid metal layers 4 and 5 to further increase thermal conductivity depending upon the embodiment.