摘要 |
<p>Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.</p> |
申请人 |
INTEVAC, INC.;LEAHEY, PATRICK;LAWSON, ERIC;LIU, CHARLES;BLUCK, TERRY;FAIRBAIRN, KEVIN, P.;RUCK, ROBERT, L.;HARKNESS, IV., SAMUEL, D. |
发明人 |
LEAHEY, PATRICK;LAWSON, ERIC;LIU, CHARLES;BLUCK, TERRY;FAIRBAIRN, KEVIN, P.;RUCK, ROBERT, L.;HARKNESS, IV., SAMUEL, D. |