| 摘要 |
<p>According to the present disclosure, a device (100, 300, 400, 500, 700), method and use for cleaning a wire (150) of a wire saw adapted for sawing a semiconductor work piece (130) is provided. The device (100, 300, 400, 500, 700) includes a container (110) including a first opening (115). The container (110) is filled with loose solid particles (111) and adapted such that the wire (150) can pass via the first opening (115) through the loose solid particles (111).</p> |
